Inspection

Lead-Free assembly has a significant impact on all stages of the printed circuit board manufacturing and assembly processes. Moving to Lead-Free assembly will also necessitate significant changes in test and inspection methodologies, including optical inspection, X-ray inspection and in-circuit testing. This section gives a brief overview of some of the factors that need to be taken into account and some of the changes that have to be made when performing inspection and testing of Lead-Free assemblies.

Optical inspection

X-ray inspection

In circuit testing (ICT)

Inspection summary