Introduction
What are the WEEE and RoHS Directives?
How will the Directives affect my company?
Actions for complying with WEEE
Actions for Complying with RoHS
Introduction to lead free
Choosing your materials
Laminates
Solderable finishes
Components
Component finishes
Lead-free solders
Soldering
Hand Soldering
Reflow Soldering
Wave Soldering
Faults
Solder Balling
Tombstoning
Fillet Lifting
Tin Whiskering
Tin Pest
Component failure
Popcorning
PCB warping
Conductive Anodic Filaments
PCB Barrel Cracking
Measling and delamination
Inspection
Optical Inspection
X-ray inspection
In circuit testing (ICT)
Lead-free reliability
Factors impacting long term reliability
Testing
General observations
Reliability summary
Further information
How do I raise awareness?
Tools resources and further information
Site map
Lead-Free / Inspection / Inspection summary


Inspection summary

  • The established inspection and test methods used for boards assembled with tin- lead alloys can also be used with Lead-Free assemblies. However, some changes may be needed.

  • Operators need to be trained to understand that Lead-Free solders behave differently and that Lead-Free joints can have a significantly different appearance to joins with traditional alloys.

  • Whenever possible a selection of reference joints should be made available to help operators carrying out inspection.

  • With careful control and optimisation of inspection parameters, along with operator training there is no reason while the established inspection processes should not be used successfully with Lead-Free assemblies.

  • The IPC standards IPC 610D and IPC 7095/7095A provide useful reference standards and related information.