There are a number of problems and faults that can occur during Lead-Free assembly and although many of these are known with traditional tin-lead based processes their occurrence can often be exacerbated by the use of Lead-Free solder alloys and their higher soldering temperatures. There are also one or two problems which have only been identified with the move to Lead-Free assembly. However, with the correct choice of materials and processing conditions they should largely be avoidable. The problems are loosely grouped into those that are specifically associated with solders and solder joints and those that can occur with the associated PCB laminates, components and related materials.
