Introduction to Lead-Free

One of the biggest impacts of the RoHS Directive is the restriction of the use of lead-based solders and finishes in electronics assembly. Moving from tried and tested materials such as tin-lead solder to newer materials will mean changes to processes and possibly design.

This section of the toolkit will help to understand the practical concerns facing you when moving to Lead-Free assembly. It considers each stage of the electronics manufacturing process from printed circuit board design to manufacture and assembly and outlines the main issues that need to be addressed at each stage.

Choosing your materials
This section outlines the appropriate materials, components and finishes for Lead-Free assembly and details the main benefits and drawbacks of the different choices. It will assist you in making key material choices.

Soldering
This section provides a detailed outline of the implications of moving to Lead-Free materials for wave, reflow and hand soldering. It includes details on equipment capabilities and potential process changes.

Faults
The section highlights and explains the possible faults seen with Lead-Free processes and materials. It also provides details of the common causes of such faults and outlines avoidance techniques that can be used to reduce their occurrence.

Inspection
Lead-Free joints look very different to tin-lead joints; consequently this section outlines the implications for inspection teams and quality assurance staff of moving to Lead-Free materials.

Lead-Free reliability
This section considers the longer-term reliability and accelerated environmental testing implications of Lead-Free.

Further information
This section details sources of further information and help that may be of use to you and your company.